Sirkuit Terpadu (IC)
Dipasangkeun
Dipasang - Sistem dina Chip (SoC)
produsén Intel
runtuyan Automotive, AEC-Q100, Cyclone® V SE
Bungkusan baki
Status produk di stock
Arsitéktur MCU, FPGA
prosésor inti Dual-Core ARM® Cortex®-A9 MPCore™ kalawan CoreSight™
Ukuran flash-
Ukuran RAM 64 KB
Périferal DMA, POR, WDT
Konektipitas CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
speed 700MHz
atribut utama FPGA - 85K elemen logika
Suhu operasi -40°C ~ 125°C (TJ)
pakét / dipager 896-BGA
Pemasok Alat Bungkusan 896-FBGA (31×31)
